The 1.27-Socket Kit for Stamp-S3 is a surface-mount socket kit designed for the Stamp-S3, with a pitch of 1.27mm. Users can integrate it into their PCB designs to meet various embedded requirements and expand functionality.
Specification | Details |
---|---|
Operating Temperature | -40°C to 105°C |
Soldering Temperature | 230°C (30-60 seconds) / 260°C (10 seconds) |
Socket Type | 17Pin/11Pin |
Socket Height | 4.6mm |
Pitch | 1.27mm |
Net Weight | 0.4g (17p) / 0.1g (11p) |
Product Dimensions | 22 x 4.6 x 3.5mm (For 17P), 14 x 4.6 x 3.5mm (For 11P) |
Package Dimensions | 136 x 92 x 13mm |
Product Weight | 6.7g |
Package Weight | 8.7g |